flip-chip assembly

монтаж методом переверненого кристала

English-Ukrainian dictionary of microelectronics. 2013.

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  • Flip chip — Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and MEMS, to external circuitry with solder bumps that have been deposited onto the chip pads …   Wikipedia

  • Thermal copper pillar bump — The Thermal Copper Pillar Bump, also known as the thermal bump , is a thermoelectric device made from thin film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and… …   Wikipedia

  • Finetech — Infobox Company company name = Finetech GmbH Co. KG company company type = GmbH Co. KG foundation = 1992 location city = Berlin location country = Germany Headquarters = Berlin key people = Gunter Kuerbis, CEO industry = Engineering products =… …   Wikipedia

  • Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… …   Wikipedia

  • PDP-8 — A PDP 8 on display at the Smithsonian s National Museum of American History in Washington, D.C.. This example is from the first generation of PDP 8s, built with discrete transistors and later known as the Straight 8. The 12 bit PDP 8 was the… …   Wikipedia

  • Integrated circuit packaging — Early USSR made integrated circuit Integrated circuit packaging is the final stage of semiconductor device fabrication per se, followed by IC testing.Packaging in ceramic or plastic prevents physical damage and corrosion and supports the… …   Wikipedia

  • Pentium OverDrive — The Pentium OverDrive was a microprocessor marketing brand name used by Intel, to cover a variety of consumer upgrade products sold in the mid 1990s. It was originally released for 486 motherboards, and later some Pentium sockets. Intel dropped… …   Wikipedia

  • Bahgat G. Sammakia — is an Egyptian American mechanical engineer. He is currently a professor of mechanical engineering and director of both the Integrated Electronics Engineering Center and the Small Scale Systems Packaging Center at Binghamton University a part of… …   Wikipedia

  • Field-programmable gate array — FPGAs should not be confused with the flip chip pin grid array, a form of integrated circuit packaging. A field programmable gate array is a semiconductor device containing programmable logic components called logic blocks , and programmable… …   Wikipedia

  • List of Intel microprocessors — For a list of Intel s microcontrollers, see List of common microcontrollers#Intel. This generational and chronological list of Intel microprocessors attempts to present all of Intel s processors from the pioneering 4 bit 4004 (1971) to the… …   Wikipedia

  • Three-dimensional integrated circuit — In electronics, a three dimensional integrated circuit (3D IC, 3D IC, or 3 D IC) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor… …   Wikipedia

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